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Capabilities

   Standard                        Advanced      
 Number of Layer  1-20 layers   24 layer
 Max Panel Size  21"x24"  24"x30"
 Max PCB thickness

 0.125"  [3.2mm]

0.177"  [4.5mm]

 Min PCB thickness

0.006"  [0.15mm]

0.004"  [0.10mm]

 Mechancial drill size

0.008"   [0.20mm]

0.004"   [0.10mm]

 Outer Layer Trace/Spacing (1/3 oz)

 0.0035"/0.0035"   [90μm/90μm]

 0.0025"/0.003"   [64μm/76μm]

 Inner Layer Trace/Spacing (H oz)

 0 003"/0 003"       [76μm/76μm]

 0.002"/0.0025"   [50μm/64μm]

 Aspect Ration  10:1  12:1
 Copper Weight

 5 oz      [178μm]

 6 oz        [214μm]

 Core thickness

 0.002"   [50μm]

 0.0015"   [38μm]

 Dielectric thickness

 0.0025" [64μm]

 0.0015"   [38μm]

 Pad Size over Drill

 0.018"   [0.46mm]

 0.016"     [0.4mm]

 Solder Mask Registration

 +/‐ 0.002"   [50μm]

 +/‐ 0.0015"  [38μm]

 Mimimum Solder Mask Dam

 0.003"   [76μm]

 0.0025"  [64μm]

 Copper feature to PCB edge

 0.015"   [0.38mm]

 0.010"    [0.25mm]

 Tolerance on overall dimensions

 +/‐ 0.004"   [100μm]

 +/‐ 0.002"  [50μm]

 

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